India has marked a significant step in strengthening its semiconductor ecosystem with the launch of the country’s first 3D glass substrate-based semiconductor packaging project in Bhubaneswar’s Info Valley. The facility is being developed with an investment of around ₹1,900–2,000 crore and focuses on advanced chip packaging technologies.
The project is designed to support next-generation applications including artificial intelligence, high-performance computing, telecommunications, and defence electronics. By introducing glass substrate technology, the facility aims to enhance performance, efficiency, and miniaturization in semiconductor manufacturing.
The foundation stone for the project was laid in the presence of Odisha Chief Minister Mohan Charan Majhi and Union Electronics and IT Minister Ashwini Vaishnaw. Officials highlighted that the initiative places Odisha among the early regions in India to adopt advanced semiconductor packaging technologies.
The upcoming facility is expected to generate nearly 2,500 direct and indirect jobs, creating opportunities across engineering, technical, and skilled labour segments. It is also likely to contribute to the development of a local semiconductor ecosystem in the region.
Government representatives described the project as a major milestone for India’s electronics manufacturing ambitions, noting that such investments will play a key role in strengthening the country’s position in the global semiconductor value chain. The unit is expected to begin commercial production in the coming years after completion of construction and installation work.
